Yesterday afternoon, MediaTek announced its new mid-range SoC, the highly anticipated Dimensity 8300, which aims to offer more powerful and affordable smartphones. This SoC places a strong emphasis on Artificial Intelligence and gaming performance.
Like its direct competitor, the Snapdragon 7 Gen 3, this SoC is manufactured by TSMC using their 4nm fabrication process, resulting in a more powerful and efficient mid-range chip.
Specifications of the MediaTek Dimensity 8300 SoC:
The MediaTek Dimensity 8300 features an 8-core configuration with four high-performance Cortex-A715 cores, one running at 3.35 GHz, and the other three operating at 3.00 GHz. These cores are paired with more energy-efficient Cortex-A510 cores running at 2.20 GHz. Compared to its predecessor, it includes not only new cores but also faster ones. The chip’s 8 cores with Armv9 architecture promise up to a 20% performance increase compared to the Dimensity 8200 SoC while consuming 30% less power.
For graphics, the chip includes a new Mali-G615 GPU, offering 60% more performance compared to the Mali-G610 MC6 GPUs found in the Dimensity 8200. Additionally, this enhances energy efficiency by up to 55%. For better performance, the SoC integrates an LPDDR5X memory controller supporting memory speeds of up to 8.533 Mbps (compared to 6.400 Mbps) and high-performance storage (UFS 4.0 vs UFS 3.1). This translates into a 17% faster launch of applications and a 47% speed improvement when reopening background applications.
Furthermore, the MediaTek Dimensity 8300 integrates an APU 780 to accelerate AI. This makes it the first mid-range SoC capable of supporting Generative AI like stable diffusion and language model LLM with up to 10 billion parameters.
Other information:
The SoC Dimensity 8300 also incorporates the Imagiq 980 ISP, remaining capable of supporting photographic sensors up to 320 megapixels and capturing 4K video at 60 FPS with HDR10+. On the connectivity front, there are slight improvements, with 5G offering download speeds of up to 5.17 Gbps (vs 4.7 Gbps). The chip maintains the same Wi-Fi 6E and features a more modern version of Bluetooth (5.4).
As for the display, support for WQHD+ resolution panels at 120 Hz remains, while Full HD+ panels now support refresh rates of up to 1280 Hz (vs 168 Hz of its predecessor). Xiaomi is expected to be the first manufacturer to release this SoC, specifically in the upcoming Redmi K70E.
By combining the exceptional CPU and GPU performance with flagship memory and storage speeds, the Dimensity 8300 ensures incredible daily experiences in gaming, apps, cameras, connectivity, and entertainment.
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